Handbook of Silicon Wafer Cleaning Technology (Materials Science and Process Technology)

Description

The second edition of the Handbook of Silicon Wafer Cleaning Technology is a collection of invited papers on wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow is presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. The Handbook reviews the current cleaning technologies, as well as advanced cleaning technologies under investigation for next generation processing, including supercritical fluid, laser, and cryoaerosol cleaning techniques. In addition, the theoretical aspects of the cleaning technologies and how these processes affect the wafer are discussed, including device damage and surface roughening. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included.

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